Department // 04 · Physical Engineering

Structural integrity & thermal / kinematic engineering.

Lekuko Mechanics bridges digital logic and physical reality, engineering hardware architecture from rapid prototyping through industrial fabrication.

View capability matrix CAD / FEA / CFD
Built for conditions outside the lab

Physical architecture // Edge foundation

Hardware is not an afterthought.

Cloud platforms and machine-learning algorithms fail if the housing warps, leaks, or overheats. Mechanical engineering is the physical foundation of edge computing, computer vision, and mechatronic reliability.

We combine precision CAD/CAM, FEA structural simulation, CFD thermal modeling, enclosure design, and passive heat dissipation. Physical systems are designed around mechanical stress, kinetic vibration, and harsh thermal environments.

Architectural stack | Capability matrix

Specialists. Under one roof.

Scope, materials and response targets shaped around each deployment's physical and operational constraints.

Pillar 01 | Prototype01

Rapid prototyping & additive manufacturing

Move parametric design into stress-tested physical hardware.

DMLS / SLMMetal printing in aluminum alloys and stainless steel for structural and thermal components.
HP MJF PA12 NylonAccurate, dimensionally stable functional parts with production-grade finishes.
SLS PA12 / PA11Durable complex geometries without support structures.
Industrial FDMASA, polycarbonate, nylon and carbon-fibre nylon for UV resistance and stiffness.

Pillar 02 | Simulation02

CAD/CAM modeling & structural FEA

Find physical failure points before material fabrication.

Parametric designSolidWorks CAD for tight-tolerance chassis and housings.
Finite Element AnalysisAssess structural stress and deformation under operational loads.
Computational Fluid DynamicsModel airflow and heat transfer away from processing nodes.
Kinetic isolationReduce vibration transfer to sensitive optical and sensor assemblies.

Pillar 03 | Production03

Industrial fabrication & rugged enclosures

Production-ready hardware for continuous field operation.

Environmental sealingIP67/IP68 enclosure design aligned to NEMA / IEC requirements.
CNC machiningCustom aluminum and alloy chassis fabrication.
Vibration-dampened opticsMounts designed to reduce kinetic blurring in vision systems.
Passive thermal managementFinned heat-sink architecture integrated into housing structures.

Deployment briefing | MECH-FAB-01Mechanical engineering · Thermal management · Structural housing

Production deployed | Anonymized

A sealed housing for a hot, vibrating factory floor.

An inline inspection camera needed optical stability above a high-speed conveyor while edge compute ran continuously above 50°C ambient. Active fan cooling was excluded to avoid a dust-ingress failure point.

<50msinference stability under load

0thermal throttling reported

100%optical isolation reported

Constraints & physics

Optical isolationFactory-floor vibration caused frame blur and rejected vision frames.
Passive heat dissipationCompute modules required continuous operation above 50°C without fans.
Environmental sealingOptics needed precise alignment inside an IP67/IP68 enclosure.

Fabrication topology

[ SOLIDWORKS CAD ]
       v
[ FEA + CFD THERMAL SIMULATION ]
       v
[ FDM / DMLS PROTOTYPE ]
       v
[ HP MJF PA12 + SEALED PRODUCTION HOUSING]

Rigorous material selection and virtual simulation address common field failure modes: thermal throttling, structural warping and optical distortion. Validate thermal behavior with CFD and structural loads with FEA before fabrication.

Multi-team orchestration

Lekuko Mechanics — Designed thermal paths, vibration isolation and the production enclosure.

Lekuko IoT — Provided compute wattage, dissipation coefficients and SOM constraints.

Lekuko Mechatronics — Integrated wiring and actuator interfaces without compromising seals.

Terminal routing | B2B intake

Does your mandate require industrial-grade hardware?

If deployments face thermal throttling, kinetic vibration or environmental degradation, submit physical specifications for review by our mechanical engineering team.

Initiate technical briefing